谢金麒 个人简介
基本信息
姓名： 谢金麒
出生年月：1992.09
学位： 博士
职称： 副教授
研究领域（方向）： 电子材料与器件
联系方式：
邮箱：xiejinqi2021@163.com
个人简介
谢金麒，男，湖南娄底人，博士，硕士生导师，2021年博士毕业于中国科学院深圳先进技术研究院物理化学专业。主要研究领域：1）印刷电子；2）柔性热界面材料；3）能源及传感器件。现主持国家自然科学基金1项、湖南省自然科学基金1项，参与国家级科研课题多项。目前已在Energy & Environmental Science, Chemical Engineering Journal，Journal of Colloid and Interface Science等刊物上发表论文20余篇，授权国家发明专利及实用新型专利10余项。
教育经历
2016/09-2021/6，中国科学院深圳先进技术研究院，物理化学，博士
2011/09-2015/06，湘南学院，应用化学，学士
科研、学术与访学工作经历
2024/12-现今，南华大学，化学化工学院，副教授
2021/09-2024/12，南华大学，化学化工学院，讲师
主持或参加科研项目（课题）情况
(1) 国家自然科学基金青年项目, 面向高端芯片散热的高拉伸铜纳米阵列基热界面材料研究, 2023-01-01 至 2025-12-31, 主持。
(2) 湖南省自然科学基金青年项目, 弹性体纳米结构表面化学镀策略构筑新型高性能热界面材料, 2023-01-01 至 2025-12-31, 主持。
(3) 国家自然科学基金面上项目, 52073300, 氢键牺牲键策略调控热界面材料的导热系数和柔性特性研究, 2021-01-01 至 2024-12-31, 参与。
(4) 国家自然科学基金青年项目, 基于多模式探针技术的纳米尺度结构和力学性能与局域电化学表征, 2019-01-01 至2021-12-31, 参与。
主要论文
1. Lang Shi, Ziyang Chang, Yuhong Wu, Xin Tang, Pen Jiang, Yan Hua, Qianqian Shi, Jin-Qi Xie*, Photocatalytic production of hydrogen peroxide facilitated by Homogeneously Distributed 2D/2D S-scheme SCN/VS-SnS2 heterojunction, Chemical Engineering Journal, 2025, 507, 160563.
2. Tiyang Xiao, Yang Tao, Sanying Hou*, Hongqing Wang*, Jin-Qi Xie*, Yinlin Chang, Qing Fu, Kejie Du, Shi Zhou, Fe/Fe3C nanoparticles embedded in nitrogen-doped carbon nanotubes for efficient degradation of tetracycline hydrochloride, Separation and Purification Technology, 2025, 356:129916.
3. Jing Tian, Sanying Hou, Lingjie Mao, Xin Xu, Humeizi Cao, Xinyi Duan, Lingsisi Li, Zhiling Zhou, Yaqiang Ji, Jin-Qi Xie*, Printable and filament-drawable PDMS based adhesive assisted manufacturing of highly conductive copper micro-patterns, Journal of Colloid and Interface Science, 2025, 677:130-139.
4. Jin-Qi Xie, Daozhuo Ji, Ziyang Chang, Yuhong Wu, Qiqi Lv, Xiaokang Liu, Lang Shi, Synergy of P doping and crystallinity modulation in carbon nitride for enhancing photocatalytic uranyl reduction. Journal of Colloid and Interface Science, 2025, 678:63-76.
5. Jin-Qi Xie, Jing Tian, Lingjie Mao, Humeizi Cao, Xinyi Duan, Lingsisi Li, Lang Shi, Yaqiang Ji, Xian-Zhu Fu, Multifunctional PDMS/Schiff base/SiO2 gel assisted fabrication of printed, stretchable and straight copper conductors. Chemical Engineering Journal, 2024, 496:154273.
6. Sanying Hou*, Hailong Hu, Qing Fu, Tiyang Xiao, Jin-Qi Xie*, Siew-Hwa Chan*, Mengjun He, Bin Miao, Lan Zhang, Undaria pinnatifida (wakame)-derived Fe, N co-doped graphene-like hierarchical porous carbon as highly efficient catalyst for activation of peroxymonosulfate (PMS) toward degradation of tetracycline (TC), Separation and Purification Technology, 2024, 333: 125980.
7. Jin-Qi Xie*, Jing Tian, Lingjie, Mao, Humeizi Cao, Binbin Zhou, Lang Shi, Sanying Hou*, Yaqiang Ji*, Xian-Zhu Fu, A facile and universally applicable additive strategy for fabrication of high-quality copper patterns based on a homogeneous Ag catalyst ink, Chemical Engineering Journal, 2023, 477: 147115.
8. Jin-Qi Xie, Meng Han, Xiangliang, Zeng, Dasha Mao, Haitong Li, Xiaoliang Zeng, Ruiheng Liu*, Linlin Ren*, Rong Sun*, Jianbin Xu, Flexible pCu2Se-nAg2Se thermoelectric devices via in situ conversion from printed Cu patterns, Chemical Engineering Journal, 2022, 435: 135172.
9.Jin-Qi Xie, Xian-Zhu Fu*, Rong Sun*, et al., NiMn hydroxides supported on porous Ni/graphene films as high electrically and thermally conductive electrodes for supercapacitors, Chemical Engineering Journal, 2020, 393, 124598.
10. Jin-Qi Xie, Yaqiang Ji, Jiahui Kang, Jiali Sheng, Dasha Mao, Xian-Zhu Fu*, Rong Sun*, Ching-Ping Wong, In situ growth of Cu(OH)2@FeOOH nanotube arrays on catalytically deposited Cu current collector patterns for high-performance flexible in-plane micro-sized energy storage devices, Energy & Environmental Science, 2019, 12, 194-205.
11. Jin-Qi Xie, Yaqiang Ji, Dasha Mao, Futao Zhang, Xian-Zhu Fu*, Rong Sun*, Ching-Ping Wong, Sn-Nanorod-Supported Ag Nanoparticles as Efficient Catalysts for Electroless Deposition of Cu Conductive Tracks, ACS Applied Nano Materials, 2018, 1, 1531-1540.
12. Jin-Qi Xie, Xian-Zhu Fu*, Rong Sun*, et al., Electroplating fabrication and characterization of Sn-Ag-Cu eutectic solder films, 17th International Conference on Electronic Packaging (ICEPT), 2016, 318-321.
13. Jin-Qi Xie, Xian-Zhu Fu*, Rong Sun*, et al., Thermally conductive adhesives based on silver coated copper flake fillers, 16th International Conference on Electronic Packaging (ICEPT), 2015, 294-296.
14. Jin-Qi Xie, Chuan-Hua Li*, et al., The standard molar enthalpy of formation of a new copper(II) Schiff-base complex and its interaction with bovine serum albumin, Thermochimica Acta, 2014, 598, 7-15.
专利
1. 谢金麒; 毛凌杰; 蔡进辉; 田晶; 曹胡美子; 一种可拉伸的电/热导件; ZL202410810490.5
2. 谢金麒; 田晶; 曹胡美子; 毛凌杰 ; 一种基于均相离子型催化油墨制备铜印刷电路的普适工艺; CN202310857725.1
3. 符显珠，谢金麒，康佳慧，盛家利，孙蓉；一种印刷电路的基板和基板组；CN201721808458.5
4. 孙蓉，谢金麒，符显珠；微纳米Sn的制备方法和微纳米Sn的应用；CN201510697792.7
5. 孙蓉，纪亚强，谢金麒，符显珠；一种基于锡银铜合金镀的电镀装置和电镀结构；CN201510728416.X
